'AirPods 3' to adopt SiP technology similar to AirPods Pro, Kuo says

Apple's next-generation in-ear AirPods product will move to a more complex system-in-package chip solution, replacing surface mount technology used in current versions of the device, according to TF Securities analyst Ming-Chi Kuo. Compared to SMT technology, SiP systems typically enable manufacturers to pack more components into a smaller space. Apple's AirPods Pro, for example, employs an SiP design with an Apple-designed H1 chip that handles audio, Siri commands, noise-cancelling capabilities and more.
Read more: https://appleinsider.com/articles/20/07/07/airpods-3-to-adopt-sip-technology-similar-to-airpods-pro-ming-chi-kuo-says?source=Snapzu